منابع مشابه
Using Photonic Integrated Circuits
Contention resolution and forwarding of labeled optical packets at 40 Gb/s is demonstrated utilizing multiple InP based optical buffers and monolithic wavelength converters. Layer-2 packet recovery measurements are presented. ©2009 Optical Society of America OCIS codes: (060.1810) Buffers, couplers, routers, switches, and multiplexers; (060.6719) Switching, packet
متن کاملMicromechanical Photonic Integrated Circuits
The ability to integrate micro-optical elements with movable structures and microactuators has opened up many new opportunities for optical and optoelectronic systemsI2. It allows us to manipulate optical beams more effectively than conventional methods, and is scalable to large optical systems. Optical MEMS (MicroElectroMechanical Systems) have applications in display, sensing, and optical dat...
متن کاملPhotonic Integrated Circuits
Large-scale photonic integrated circuits (PICs) in Indium Phosphide represent a significant technology innovation that simplifies optical system design, reduces space and power consumption, and improves reliability. In addition, by lowering the cost of optical-to-electrical-to-optical (OEO) conversion in optical networks, they provide a transformational opportunity to embrace the use of electro...
متن کاملSurface-Micromachined Photonic Integrated Circuits
The ability to integrate micro-optical elements with movable structures and microactuators has opened up many new opportunities for optical and optoelectronic systems"2. It allows us to manipulate optical beams more effectively than conventional methods, and is scalable to large optical systems. Optical MEMS (MicroElectroMechanical Systems) have applications in di~play~"'~, sensing6, and optica...
متن کاملPhotonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the labo...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Photonics Russia
سال: 2017
ISSN: 1993-7296
DOI: 10.22184/1993-7296.2017.68.8.58.67